Originally shared by Rifle Creek
This is the preliminary layout for break out breadboards for makers to quickly expand the electronics from IC chip to solid state hardware. The plan is to produce a triangular IC chip with pin outs, with the ability to daisy chain communication, detection, and mobility shields.
Spacing between square contact pads would be the standard 2 mm o.c.
Each bagel board can be individually refined with internal layers to connect the associated contact points. The photo shows an array of 4 bagel boards, stacked like tree branches. The bagel boards can also be stacked directly on top of each other.
This would be an easy tool in teaching the youth how to breakout their electronic packages while prototyping electronic gear.
It is also an incentive to think out of the box and produce a triangular IC.
Please post your thoughts and let’s cooperate.
We are running a 3D printed prototype of this today… will post later.